This article talks about radio frequency PCB layout. Let’s get started.
This is a common guide to the finest practice PCB development rules for a high frequency or RF circuit. Following these regulations would assist you to neglect a few of the most general pitfalls in radio frequency design. Inadequate printed circuit technology layout is one of the most general cause of poor transmit or get performance & EMC failures owing to counterfeit emissions. Preferably an engineer undertaking a printed circuit board design must be aware of the IPC standards since these offer a great source of info & finest practice on the common principles of printed circuit board design.
When wishing to layout a radio frequency PCB, the foremost place to begin is to get in touch with your chosen board manufacturer and get a set of their guidelines & fabrication competencies. This would comprise the min. track & gap widths, drilling sizes & other important parameters.
The board fabricator must moreover be capable to offer you with their common layer stack & material data, this would comprise the copper weights, dielectric constant, & the width of core & pre-preg layers in multi layered boards. Until your circuit is very easy I recommend that a four layer board is utilized this makes sure a continual ground plane. While utilizing a dual sided board it is extremely tough to make certain that the ground plane is uninterrupted. Another benefit of a four layer board is the proportions of the micro-strip for a 60 to 80 ohm design are more convenient.
Make use of a micro-strip calculator to gauge the needed track width for the design impedance & make sure that it is within the fabricator’s competencies, in case not you might have to talk about the layer stack with the fabricator & pick a non common build. Another factor to note down is that in my experience trying to keep up distinct ground nets for various signal region’s more often than not brings about problems instead of any advantage and is mainly a throwback to the days before multi-layer boards, one low impedance ground plane is the most secure route.
It is pretty acceptable to utilize FR4 for boards up to 3.2
Giga Hertz until the greatest level of performance is needed. In some cases it
is worth specifically the board since controlled impedance to offer continuous
radio frequency performance.
After determining the track & board geometries the
subsequent step is to deal with the part placement. Make sure that the radio
frequency elements are laid out in order that all the radio frequency tracks
could be maintained on the top surface with min length & changes of
direction. Begin with low signal level regions at the antenna or radio
frequency input & function backwards to the base band or digital region.
Maintain digital & power supply regions clear of the analogue radio
frequency circuitry & maintain all the RF elements over one side of the
board.
Where your radio frequency tracks cannot be worked in a
straight line, utilize mitered bends in case your CAD system advocates them,
never utilize right angled bends over radio frequency signal lines. In case
mitered bends are not supported utilize a series of 45˚ bends or arcs, this lessens
impedance mismatches that will enhance losses & bogus emissions.
On radio frequency layouts it is general to offer a basic
flood over the top layer & to stitch this to the basic plane by utilizing
multiple vias. In case you wish to carry out this, make sure that the copper is
maintained an appropriate distance from the radio frequency tracks &
elements else the impedance would be lowered & bring about more damage than
good.
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